Preliminary Datasheet
3A DDR TERMINATION REGULATOR
Typical Performance Characteristics (Continued)
AP2302
350
350
Package: SOIC-8
No Heatsink
300
Package: TO-252-5L
No Heatsink
300
Copper Area (mm )
Copper Area (mm )
2
250
250
T
C
=25 C
T
C
=50 C
T
C
=65 C
o
o
2
o
200
200
T
C
=25 C
150
o
o
o
T
C
=50 C
T
C
=65 C
150
100
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
100
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
Power Dissipation (W)
Power Dissipation (W)
Figure 12. Copper Area vs. Power Dissipation
Figure 13. Copper Area vs. Power Dissipation
350
Package: TO-263-5L
No Heatsink
300
Copper Area (mm )
2
250
T
C
=25 C
T
C
=50 C
T
C
=65 C
o
o
o
200
150
100
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
10.5
11.0
Power Dissipation (W)
Figure 14. Copper Area vs. Power Dissipation
Jul. 2006 Rev. 1. 2
8
BCD Semiconductor Manufacturing Limited
BCDSEMI [ BCD SEMICONDUCTOR MANUFACTURING LIMITED ]
