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SBVS001D − OCTOBER 1992 − REVISED JULY 2004
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handledwith appropriate precautions. Failure to observe
(1)
ABSOLUTE MAXIMUM RATINGS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . Internally Limited
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +15V
Operating Junction Temperature Range . . . . . . . . −40°C to +125°C
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
Storage Temperature Range . . . . . . . . . . . . . . . . . −65°C to +150°C
(2)
Lead Temperature (soldering, 10s)
. . . . . . . . . . . . . . . . . +300°C
(1)
(2)
Stresses above these ratings may cause permanent damage.
See Soldering Methods section.
CONNECTION DIAGRAM
Front View
Plastic DDPAK
Plastic SOT−223
Tab is
VOUT
Tab is VOUT
Ground VOUT
(Adj.)(1)
VIN
Ground VOUT
(Adj.)(1)
VIN
NOTE: (1) Adjustable−Voltage Model.
2
BB [ BURR-BROWN CORPORATION ]
