PGA2310
SBOS207B − OCTOBER 2001 − REVISED JUNE 2004
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
PGA2310
VA+
VA−
VD+
Analog input voltage
Digital input voltage
Operating temperature range
Storage temperature range
Junction temperature
Lead temperature (soldering, 10s)
+16.0
−16.0
+6.5
0 to VA+, VA−
−0.3 to VD+
−55 to +125
−65 to +150
+150
+300
UNIT
V
V
V
V
V
°C
°C
°C
°C
Supply voltage
Package temperature (IR, reflow, 10s)
+235
°C
(1) Stresses above those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or
any other conditions beyond those specified is not implied.
ORDERING INFORMATION
(1)
PRODUCT
PACKAGE−LEAD
DIP-16
PGA2310
SOL-16
PACKAGE
DESIGNATOR
N
DW
−40 C +85 C
−40°C to +85°C
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
PGA2310PA
PGA2310UA
PGA2310UA
ORDERING
NUMBER
PGA2310PA
PGA2310UA
PGA2310UA/1K
TRANSPORT
MEDIA, QUANTITY
Rails, 25
Rails, 48
Tape and Reel, 1000
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
2
BURR-BROWN [ BURR-BROWN CORPORATION ]
