DICE INFORMATION
PAD
FUNCTION
PAD
FUNCTION
9
VO2
Ref
1
2
3
4
5
6
7
8
VO1
—
—
10
11
12
13
14
15
16
VO
Feedback
V+
Dig. Ground
A0
V–
V+
FPO
IN
IN
VOS Adj
OS Adj
V–
V
A1
Substrate Bias: Internally connected to V– power supply.
MECHANICAL INFORMATION
MILS (0.001")
MILLIMETERS
Die Size
Die Thickness
Min. Pad Size
186 x 130 ±5
20 ±3
4.72 x 3.30 ±0.13
0.51 ±0.08
4 x 4
0.1 x 0.1
Backing
Gold
PGA204/205 DIE TOPOGRAPHY
PIN CONFIGURATION
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with ap-
propriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
Top View
VO1
NC
NC
1
2
3
4
5
6
7
8
16 A1
15 A0
14 Dig. Ground
13 V+
V–
IN
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
V+
12 Feedback
11 VO
IN
VOS Adjust
VOS Adjust
V–
10 Ref
9
VO2
NC: No Internal Connection.
®
5
PGA204/205
BB [ BURR-BROWN CORPORATION ]
