DICE INFORMATION
PAD
FUNCTION
V
O1
—
—
V
–IN
V
+IN
V
OS
Adj
V
OS
Adj
V–
PAD
9
10
11
12
13
14
15
16
FUNCTION
V
O2
Ref
V
O
Feedback
V+
Dig. Ground
A
0
A
1
FPO
1
2
3
4
5
6
7
8
Substrate Bias:
Internally connected to V– power supply.
MECHANICAL INFORMATION
MILS (0.001")
Die Size
Die Thickness
Min. Pad Size
Backing
186 x 130
±5
20
±3
4x4
MILLIMETERS
4.72 x 3.30
±0.13
0.51
±0.08
0.1 x 0.1
Gold
PGA204/205 DIE TOPOGRAPHY
PIN CONFIGURATION
Top View
ELECTROSTATIC
DISCHARGE SENSITIVITY
16 A
1
15 A
0
14 Dig. Ground
13 V+
12 Feedback
11 V
O
10 Ref
9
V
O2
V
O1
NC
NC
V
–IN
V
+IN
V
OS
Adjust
V
OS
Adjust
V–
1
2
3
4
5
6
7
8
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with ap-
propriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
NC: No Internal Connection.
®
5
PGA204/205
BURR-BROWN [ BURR-BROWN CORPORATION ]
