SPECIFICATIONS
All specifications at +25°C, VDD = VCC = 3.0V, fS = 44.1kHz, SYSCLK = 384fS, CLKIO Input, 18-bit data, unless otherwise noted.
PCM3002E/3003E
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
DAC CHARACTERISTICS
RESOLUTION
20
Bits
DC ACCURACY
Gain Mismatch Channel-to-Channel
Gain Error
Gain Drift
Bipolar Zero Error
Bipolar Zero Drift
±1.0
±1.0
±20
±1.0
±20
±3
±5
% of FSR
% of FSR
ppm of FSR/°C
% of FSR
ppm of FSR/°C
DYNAMIC PERFORMANCE(9)
THD+N: VOUT = 0dB (Full Scale)
VOUT = –60dB
Dynamic Range
Signal-to-Noise Ratio
Channel Separation
–86
–28
94
94
91
–80
dB
dB
dB
dB
dB
EIAJ, A-Weighted
EIAJ, A-Weighted
88
88
86
DIGITAL FILTER PERFORMANCE
Passband
Stopband
Passband Ripple
Stopband Attenuation
Delay Time
0.445fS
Hz
Hz
dB
dB
sec
0.555fS
–35
±0.17
11.1/fS
ANALOG OUTPUT
Voltage Range
Center Voltage
0.60 x VCC
0.5 x VCC
Vp-p
VDC
kΩ
Load Impedance
AC-Coupling
f = 20kHz
10
LPF Frequency Response
–0.16
dB
POWER SUPPLY REQUIREMENTS
Voltage Range: VCC, VDD
–25°C to +85°C
0° C to +70°C(10)
VCC = VDD = 3.0V
VCC = VDD = 3.0V
VCC = VDD = 3.0V
VCC = VDD = 3.0V
2.7
2.4
3.0
3.0
18
50
54
3.6
3.6
24
VDC
VDC
mA
µA
mW
µW
Supply Current: Operation
Power-Down
Power Dissipation: Operation
Power-Down(11)
72
150
TEMPERATURE RANGE
Operation
Storage
–25
–55
+85
+125
°C
°C
Thermal Resistance, ΘJA
100
°C/W
PACKAGE/ORDERING INFORMATION
PACKAGE
DRAWING
NUMBER
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER(1)
TRANSPORT
MEDIA
PRODUCT
PACKAGE
PCM3002E
SSOP-24
338
"
–25°C to +85°C
PCM3002E
PCM3002E
PCM3002E/2K
PCM3003E
Rails
"
"
"
"
Tape and Reel
Rails
PCM3003E
"
SSOP-24
"
338
"
–25°C to +85°C
PCM3003E
"
"
PCM3003E/2K
Tape and Reel
NOTES: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering 2000 pieces
of “PCM3002E/2K” will get a single 2000-piece Tape and Reel.
ABSOLUTE MAXIMUM RATINGS
ELECTROSTATIC
Supply Voltage
DISCHARGE SENSITIVITY
+VDD, +VCC1, +VCC2 ...................................................................... +6.5V
Supply Voltage Differences............................................................... ±0.1V
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
GND Voltage Differences.................................................................. ±0.1V
Digital Input Voltage ...................................................... –0.3 to VDD + 0.3V
Analog Input Voltage......................................... –0.3 to VCC1, VCC2 + 0.3V
Power Dissipation .......................................................................... 300mW
and installation procedures can cause damage.
Input Current ................................................................................... ±10mA
Operating Temperature Range ......................................... –25°C to +85°C
Storage Temperature ...................................................... –55°C to +125°C
ESD damage can range from subtle performance degrada-
Lead Temperature (soldering, 5s).................................................. +260°C
(reflow, 10s) ..................................................... +235°C
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
®
3
PCM3002/3003