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SLES035C − MARCH 2002 − REVISED MARCH 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGING ORDERING INFORMATION
PCM2900
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESIGNATOR
PACKAGE
MARKING
ORDERING
(1)
NUMBER
TRANSPORT
MEDIA
PRODUCT
PACKAGE−LEAD
PCM2900E
Rails
PCM2900E
SSOP-28
28DB
−25°C to 85°C
PCM2900E
PCM2900E/2K
Tape and reel
(1)
Models with a slash (/) are available only in tape and reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering 2000
pieces of PCM2900E/2K gets a single 2000-piece tape and reel.
PCM2902
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESIGNATOR
PACKAGE
MARKING
ORDERING
(1)
NUMBER
TRANSPORT
MEDIA
PRODUCT
PACKAGE−LEAD
PCM2902E
Rails
PCM2902E
(1)
SSOP-28
28DB
−25°C to 85°C
PCM2902E
PCM2902E/2K
Tape and reel
Models with a slash (/) are available only in tape and reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering 2000
pieces of PCM2902E/2K gets a single 2000-piece tape and reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
PCM2900/PCM2902
–0.3 to 6.5
0.1
UNIT
Supply voltage, V
BUS
V
V
V
Ground voltage differences, AGNDC, AGNDP, AGNDX, DGND, DGNDU
(2)
SEL0, SEL1, TEST0 (DIN)
−0.3 to 6.5
Digital input voltage
−0.3 to (V
+ 0.3) <
DDI
4
(2)
D+, D–, HID0, HID1, HID2, XTI, XTO, TEST1 (DOUT) , SSPND
V
V
−0.3 to (V
+ 0.3)
CCCI
V
L, V R, V
, V
R, V L
OUT
IN IN COM OUT
< 4
−0.3 to 4
10
Analog input voltage
V
, V , V , V
, V
V
mA
°C
CCCI CCP1I CCP2I CCXI DDI
Input current (any pins except supplies)
Ambient temperature under bias
−40 to 125
−55 to 150
150
Storage temperature, T
stg
°C
Junction temperature T
°C
J
Lead temperature (soldering)
260
°C, 5 s
°C
Package temperature (IR reflow, peak)
250
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
( ): PCM2902
(2)
2
BB [ BURR-BROWN CORPORATION ]
