欢迎访问ic37.com |
会员登录 免费注册
发布采购

OPA277UAE4 参数 Datasheet PDF下载

OPA277UAE4图片预览
型号: OPA277UAE4
PDF下载: 下载PDF文件 查看货源
内容描述: 高精密运算放大器 [High Precision OPERATIONAL AMPLIFIERS]
分类和应用: 运算放大器光电二极管
文件页数/大小: 25 页 / 922 K
品牌: BB [ BURR-BROWN CORPORATION ]
 浏览型号OPA277UAE4的Datasheet PDF文件第9页浏览型号OPA277UAE4的Datasheet PDF文件第10页浏览型号OPA277UAE4的Datasheet PDF文件第11页浏览型号OPA277UAE4的Datasheet PDF文件第12页浏览型号OPA277UAE4的Datasheet PDF文件第14页浏览型号OPA277UAE4的Datasheet PDF文件第15页浏览型号OPA277UAE4的Datasheet PDF文件第16页浏览型号OPA277UAE4的Datasheet PDF文件第17页  
PACKAGE OPTION ADDENDUM  
www.ti.com  
28-Jun-2007  
Orderable Device  
OPA277U/2K5  
OPA277U/2K5G4  
OPA277UA  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
8
2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
D
D
D
N
N
D
D
D
D
D
8
2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
8
100 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
OPA277UA/2K5  
OPA277UA/2K5E4  
OPA277UAE4  
OPA277UAG4  
OPA277UG4  
8
2500  
Pb-Free  
(RoHS)  
CU NIPDAU Level-3-260C-168 HR  
8
2500  
Pb-Free  
(RoHS)  
CU NIPDAU Level-3-260C-168 HR  
8
100 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
8
100 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
8
100 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
OPA4277PA  
14  
14  
14  
14  
14  
14  
14  
25 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
OPA4277PAG4  
OPA4277UA  
25 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
58 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
OPA4277UA/2K5  
OPA4277UA/2K5E4  
OPA4277UAE4  
OPA4277UAG4  
2500  
Pb-Free  
(RoHS)  
CU NIPDAU Level-3-260C-168 HR  
2500  
Pb-Free  
(RoHS)  
CU NIPDAU Level-3-260C-168 HR  
58 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
58 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
Addendum-Page 2