CONNECTION DIAGRAM
Top View —P Package
Top View—U Package
+V
S1
–V
S1
1
2
16
15
Gnd
V
IN
+V
S1
–V
S1
1
2
28
27
Gnd
V
IN
V
OUT
Gnd
7
8
10
9
–V
S2
+V
S2
V
OUT
Gnd
13
14
16
15
–V
S2
+V
S2
PACKAGE INFORMATION
PRODUCT
ISO124P
ISO124U
PACKAGE
16-Pin Plastic DIP
28-Lead Plastic SOIC
PACKAGE DRAWING
NUMBER
(1)
238
217-1
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage ...................................................................................
±18V
V
IN
......................................................................................................±100V
Continuous Isolation Voltage ..................................................... 1500Vrms
Junction Temperature .................................................................... +150°C
Storage Temperature ....................................................................... +85°C
Lead Temperature (soldering, 10s) ................................................ +300°C
Output Short to Common ......................................................... Continuous
NOTE: (1) Stresses above these ratings may cause permanent damage.
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ORDERING INFORMATION
PRODUCT
ISO124P
ISO124U
PACKAGE
16-Pin Plastic DIP
28-Lead Plastic SOIC
NONLINEARITY
MAX %FSR
±0.010
±0.010
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
®
3
ISO124
BURR-BROWN [ BURR-BROWN CORPORATION ]
