SPECIFICATIONS (Cont.)
At TA = +25°C, +VA = +5V, +VD = +5V, differential transformer coupled output, 50Ω doubly terminated, unless otherwise specified.
DAC900U/E
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
Supply Voltages
+VA
+VD
+2.7
+2.7
+5
+5
+5.5
+5.5
V
V
Supply Current(6)
IVA
24
1.1
8
170
50
45
30
2
15
230
mA
mA
mA
mW
mW
mW
IVA, Power-Down Mode
IVD
Power Dissipation
+5V, IOUT = 20mA
+3V, IOUT = 2mA
Power Dissipation, Power-Down Mode
Thermal Resistance, θJA
SO-28
75
50
°C/W
°C/W
TSSOP-28
NOTES: (1) At output IOUT, while driving a virtual ground. (2) Measured single-ended into 50Ω Load. (3) Nominal full-scale output current is 32x IREF; see Application
Section for details. (4) Reference bandwidth depends on size of external capacitor at the BW pin and signal level. (5) Typically 45µA for the PD pin, which has an
internal pull-down resistor. (6) Measured at fCLOCK = 50MSPS and fOUT = 1.0MHz.
ABSOLUTE MAXIMUM RATINGS
ELECTROSTATIC
+VA to AGND ........................................................................ –0.3V to +6V
DISCHARGE SENSITIVITY
+VDto DGND ........................................................................ –0.3V to +6V
AGNDto DGND ................................................................. –0.3V to +0.3V
This integrated circuit can be damaged by ESD. Burr-Brown
+VA to +VD .............................................................................. –6V to +6V
recommends that all integrated circuits be handled with
CLK, PD to DGND ...................................................... –0.3V to VD + 0.3V
D0-D9 to DGND .......................................................... –0.3V to VD + 0.3V
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
IOUT, IOUT to AGND............................................................ –1V to VA + 0.3V
BW, BYP to AGND....................................................... –0.3V to VA + 0.3V
ESD damage can range from subtle performance degradation
REFIN, FSA to AGND .................................................. –0.3V to VA + 0.3V
INT/EXT to AGND ........................................................ –0.3V to VA + 0.3V
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
Junction Temperature .................................................................... +150°C
Case Temperature ......................................................................... +100°C
changes could cause the device not to meet its published
Storage Temperature ..................................................................... +125°C
specifications.
PACKAGE/ORDERING INFORMATION
PACKAGE
DRAWING
NUMBER
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER(1)
TRANSPORT
MEDIA
PRODUCT
PACKAGE
DAC900U
SO-28
217
"
360
"
–40°C to +85°C
DAC900U
DAC900U
DAC900U/1K
DAC900E
Rails
Tape and Reel
Rails
"
DAC900E
"
"
"
"
TSSOP-28
–40°C to +85°C
DAC900E
"
"
"
DAC900E/2K5
Tape and Reel
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces
of “DAC900E/2K5” will get a single 2500-piece Tape and Reel.
DEMO BOARD ORDERING INFORMATION
DEMO BOARD
PRODUCT
ORDERING NUMBER
COMMENT
DAC900U
DAC900E
DEM-DAC90xU
DEM-DAC900E
Populated evaluation board without D/A converter. Order sample of desired DAC90x model separately.
Populated evaluation board including the DAC900E.
®
3
DAC900