PACKAGE OPTION ADDENDUM
www.ti.com
12-Feb-2008
Orderable Device
DAC7802KU/1KG4
DAC7802KUG4
DAC7802LP
Status (1)
ACTIVE
ACTIVE
NRND
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
24
24
24
24
24
24
24
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
SOIC
PDIP
SOIC
SOIC
SOIC
SOIC
DW
NTG
DW
DW
DW
DW
33 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
15 Green (RoHS &
no Sb/Br)
Call TI
N / A for Pkg Type
DAC7802LU
ACTIVE
ACTIVE
ACTIVE
ACTIVE
33 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
DAC7802LU/1K
DAC7802LU/1KG4
DAC7802LUG4
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
33 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
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