PACKAGE OPTION ADDENDUM
www.ti.com
29-Jan-2007
PACKAGING INFORMATION
Orderable Device
BUF634F
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
OBSOLETE DDPAK/
TO-263
KTT
5
5
5
5
5
8
8
5
5
8
8
8
8
TBD
Call TI
CU SN
CU SN
CU SN
CU SN
Call TI
BUF634F/500
BUF634F/500E3
BUF634FKTTT
BUF634FKTTTE3
BUF634P
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DDPAK/
TO-263
KTT
KTT
KTT
KTT
P
500
500
50
Pb-Free
(RoHS)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
DDPAK/
TO-263
Pb-Free
(RoHS)
DDPAK/
TO-263
Pb-Free
(RoHS)
DDPAK/
TO-263
50
Pb-Free
(RoHS)
PDIP
50 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
BUF634PG4
BUF634T
PDIP
P
50 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
TO-220
TO-220
SOIC
KC
KC
D
49 Green (RoHS &
no Sb/Br)
Call TI
N / A for Pkg Type
BUF634TG3
BUF634U
49 Green (RoHS &
no Sb/Br)
Call TI
N / A for Pkg Type
100
2500
2500
100
Pb-Free
(RoHS)
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
BUF634U/2K5
BUF634U/2K5E4
BUF634UE4
SOIC
D
Pb-Free
(RoHS)
SOIC
D
Pb-Free
(RoHS)
SOIC
D
Pb-Free
(RoHS)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
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