PIN CONFIGURATION
Top View
8-Pin Dip Package
Top View
SO-8 Surface-Mount Package
5-Lead
TO-220
BW
NC
VIN
V–
1
2
3
4
8
7
6
5
NC
V+
VO
NC
5-Lead DDPAK
Surface Mount
G = 1
G = 1
G = 1
1
2
3
4
1 2 3 4
5
5
NC = No Connection
BW
VIN
V–
V+
VO
ABSOLUTE MAXIMUM RATINGS
Supply Voltage ..................................................................................... ±18V
Input Voltage Range ............................................................................... ±VS
Output Short-Circuit (to ground) .................................................Continuous
Operating Temperature ..................................................... –40°C to +125°C
Storage Temperature ........................................................ –55°C to +125°C
Junction Temperature ....................................................................... +150°C
Lead Temperature (soldering,10s).................................................... +300°C
BW
VIN
V–
V+
NOTE: Tab electrically
connected to V–.
VO
ELECTROSTATIC
DISCHARGE SENSITIVITY
PACKAGE/ORDERING INFORMATION
Any integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
PACKAGE
DRAWING TEMPERATURE
NUMBER(1)
PRODUCT
PACKAGE
RANGE
BUF634P
BUF634U
BUF634T
BUF634F
8-Pin Plastic DIP
SO-8 Surface-Mount
5-Lead TO-220
006
182
315
325
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet
published specifications.
5-Lead DDPAK
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
®
3
BUF634
BB [ BURR-BROWN CORPORATION ]
