PACKAGE OPTION ADDENDUM
www.ti.com
1-Mar-2005
PACKAGING INFORMATION
Orderable Device
ADS7846E
Status (1)
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP/
QSOP
DBQ
16
16
16
100
None
CU NIPDAU Level-3-220C-168 HR
ADS7846E/2K5
ADS7846E/2K5G4
SSOP/
QSOP
DBQ
DBQ
2500
None
CU NIPDAU Level-3-220C-168 HR
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
ADS7846IGQCR
ADS7846IRGVR
ADS7846IRGVT
ADS7846N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VFBGA
QFN
GQC
RGV
RGV
PW
48
16
16
16
16
16
2500
2500
250
None
None
None
None
None
SNPB
Level-2A-235C-4 WKS
CU NIPDAU Level-1-220C-UNLIM
CU NIPDAU Level-3-220C-168 HR
QFN
TSSOP
TSSOP
TSSOP
94
CU SNPB
CU SNPB
Level-3-220C-168 HR
Level-3-220C-168 HR
ADS7846N/2K5
ADS7846N/2K5G4
PW
2500
PW
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
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