PIN CONFIGURATIONS
Top View
DIP
SSOP
+VCC
CH0
1
2
3
4
5
6
7
8
16 DCLK
15 CS
+VCC
CH0
1
2
3
4
5
6
7
8
16 DCLK
15 CS
CH1
14 DIN
CH1
14 DIN
CH2
13 BUSY
12 DOUT
11 MODE
10 GND
CH2
13 BUSY
12 DOUT
11 MODE
10 GND
ADS7841
ADS7841
CH3
CH3
COM
SHDN
VREF
COM
SHDN
VREF
9
+VCC
9
+VCC
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
1
2
3
4
5
6
+VCC
CH0
CH1
CH2
CH3
COM
Power Supply, 2.7V to 5V.
Analog Input Channel 0.
Analog Input Channel 1.
Analog Input Channel 2.
Analog Input Channel 3.
Ground Reference for Analog Inputs. Sets zero code voltage in single-ended mode. Connect this pin to ground or ground reference
point.
7
8
SHDN
VREF
Shutdown. When LOW, the device enters a very low power shutdown mode.
Voltage Reference Input
Power Supply, 2.7V to 5V.
Ground
9
+VCC
10
11
GND
MODE
Conversion Mode. When LOW, the device always performs a 12-bit conversion. When HIGH, the resolution is set by the MODE bit in
the CONTROL byte.
12
13
14
15
16
DOUT
BUSY
DIN
Serial Data Output. Data is shifted on the falling edge of DCLK. This output is high impedance when CS is HIGH.
Busy Output. This output is high impedance when CS is HIGH.
Serial Data Input. If CS is LOW, data is latched on rising edge of DCLK.
CS
Chip Select Input. Controls conversion timing and enables the serial input/output register.
External Clock Input. This clock runs the SAR conversion process and synchronizes serial data I/O.
DCLK
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
+VCC to GND......................................................................... –0.3V to +6V
Analog Inputs to GND ............................................ –0.3V to +VCC + 0.3V
Digital Inputs to GND ........................................................... –0.3V to +6V
Power Dissipation .......................................................................... 250mW
Maximum Junction Temperature ................................................... +150°C
Operating Temperature Range ....................................... –40°C to +85°C
Storage Temperature Range ......................................... –65°C to +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published specifi-
cations.
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
PACKAGE/ORDERING INFORMATION
MINIMUM
RELATIVE
ACCURACY
(LSB)
DIFFERENTIAL
NONLINEARITY
(LSB)
SPECIFICATION
TEMPERATURE
RANGE
PACKAGE
DRAWING
NUMBER(1)
ORDERING
NUMBER(2)
TRANSPORT
MEDIA
PRODUCT
PACKAGE
ADS7841E
"
ADS7841P
ADS7841EB
"
±2
"
±2
±1
"
68
"
68
70
"
–40°C to +85°C
16-Lead SSOP
322
"
180
322
"
ADS7841E
ADS7841E/2K5
ADS7841P
ADS7841EB
ADS7841EB/2K5
ADS7841PB
Rails
Tape and Reel
Rails
Rails
Tape and Reel
Rails
"
"
–40°C to +85°C
–40°C to +85°C
"
16-Pin PDIP
16-Lead SSOP
"
ADS7841PB
±1
70
–40°C to +85°C
16-Pin PDIP
180
NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are
available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of “ADS7841/2K5” will get a single
2500-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book.
®
ADS7841
4
BB [ BURR-BROWN CORPORATION ]
