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ADS7834E 参数 Datasheet PDF下载

ADS7834E图片预览
型号: ADS7834E
PDF下载: 下载PDF文件 查看货源
内容描述: 12位高速低功耗采样模拟数字转换器 [12-Bit High Speed Low Power Sampling ANALOG-TO-DIGITAL CONVERTER]
分类和应用: 转换器
文件页数/大小: 13 页 / 147 K
品牌: BB [ BURR-BROWN CORPORATION ]
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microcontrollers form various manufacturers. CONV would  
be tied to a general purpose I/O pin (SPI) or to a PCX pin  
(QSPI), CLK would be tied to the serial clock, and DATA  
would be tied to the serial input data pin such as MISO  
(master in slave out).  
FS = Full-Scale Voltage = VREF  
1 LSB = FS/4096  
1 LSB  
11...111  
11...110  
11...101  
Note the time tDRP shown in Figure 9. This represents the  
maximum amount of time between CONV going LOW and  
the start of the conversion clock. Since CONV going LOW  
places the sample and hold in the hold mode and because the  
hold capacitor loses charge over time, there is a requirement  
that time tDRP be met as well as the maximum clock period  
(tCKP).  
00...010  
00...001  
00...000  
0V  
2.499V(1)  
LAYOUT  
Input Voltage(2) (V)  
For optimum performance, care should be taken with the  
physical layout of the ADS7834 circuitry. This is particu-  
larly true if the CLK input is approaching the maximum  
input rate.  
NOTES: (1) For external reference, value is VREF – 1 LSB. (2) Voltage  
at converter input: +IN (IN).  
FIGURE 7. Ideal Input Voltages and Output Codes.  
The basic SAR architecture is sensitive to glitches or sudden  
changes on the power supply, reference, ground connec-  
tions, and digital inputs that occur just prior to latching the  
output of the analog comparator. Thus, during any single  
conversion for an n-bit SAR converter, there are n “win-  
dows” in which large external transient voltages can easily  
affect the conversion result. Such glitches might originate  
from switching power supplies, nearby digital logic, and  
high power devices. The degree of error in the digital output  
depends on the reference voltage, layout, and the exact  
timing of the external event. The error can change if the  
external event changes in time with respect to the CLK  
input.  
DSP INTERFACING  
Figure 8 shows a timing diagram that might be used with a  
typical digital signal processor such as a TI DSP. For the  
buffered serial port (BSP) on the TMS320C54X family,  
CONV would tied to BFSX, CLK would be tied to BCLKX,  
and DATA would be tied to BDR.  
SPI/QSPI INTERFACING  
Figure 9 shows the timing diagram for a typical serial  
peripheral interface (SPI) or queued serial peripheral inter-  
face (QSPI). Such interfaces are found on a number of  
CONV  
15  
16  
1
2
3
12  
13  
14  
15  
16  
1
2
3
4
CLK  
D11  
(MSB)  
D0  
(LSB)  
D11  
(MSB)  
DATA  
D10  
D1  
D10  
D9  
FIGURE 8. Typical DSP Interface Timing.  
tDRP  
tACQ  
CONV  
1
2
3
4
13  
14  
15  
16  
1
2
3
CLK  
D11  
(MSB)  
D0  
(LSB)  
D11  
(MSB)  
DATA  
D10  
D1  
FIGURE 9. Typical SPI/QSPI Interface Timing.  
®
ADS7834  
12  
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