PIN CONFIGURATIONS
Top View
DIP
Top View
LCC
SFR
AIN0
AIN1
AIN2
AIN3
1
2
3
4
5
6
7
8
9
28 VA
27 AGND
26 CAL (SHC)
25 A1
4
3
2
1
28 27 26
24 A0
25 A1
VREF
VREF
+
23 CLK
22 BUSY
21 HBE
20 WR
19 CS
5
6
7
8
9
AIN3
24 A0
–
VREF
+
–
23 CLK
22 BUSY
21 HBE
20 WR
19 CS
DGND
VD
VREF
DGND
VD
D7 10
D6 11
D5 12
D4 13
D3 14
18 RD
D7 10
D6 11
17 D0
16 D1
12 13 14 15 16 17 18
15 D2
PACKAGE/ORDERING INFORMATION
MINIMUM
SIGNAL-TO-(NOISE +
DISTORTION)
INTEGRAL
NONLINEARITY
MAXIMUM
LSB
SPECIFICATION
TEMPERATURE
RANGE
PACKAGE
DRAWING
NUMBER(1)
PRODUCT
RATIO, dB
PACKAGE
ADS7832BN
ADS7832BP
69
69
±3/4
±3/4
–40°C to +85°C
–40°C to +85°C
28-Pin LCC
28-Pin Plastic DIP
251
215
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.
ABSOLUTE MAXIMUM RATINGS
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
VA to Analog Ground ............................................................................. 7V
VD to Digital Ground .............................................................................. 7V
VA to VD ............................................................................................ ±0.3V
Analog Ground to Digital Ground..................................................... ±0.3V
Control Inputs to Digital Ground ................................ –0.3V to VD + 0.3V
Analog Input Voltage to Analog Ground .................... –0.3V to VA + 0.3V
Maximum Junction Temperature ..................................................... 150°C
Internal Power Dissipation............................................................. 875mW
Lead Temperature (soldering, 10s)............................................... +260°C
(soldering, 3s) ................................................ +360°C
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
Thermal Resistance, θJA ............................................................ 75°C/W
Maximum Input Current to Any Pin ............................................... ±50mA
ESD: Human Body Model .................................................................. 1kV
®
6
ADS7832
BB [ BURR-BROWN CORPORATION ]
