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SBAS274E − MARCH 2003 − REVISED JUNE 2004
ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESIGNATOR
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
PRODUCT
PACKAGE−LEAD
(1)
ADS1605IPAPT
ADS1605IPAPR
ADS1606IPAPT
ADS1606IPAPR
Tape and Reel, 250
Tape and Reel, 1000
Tape and Reel, 250
Tape and Reel, 1000
TQFP−64
PowerPAD
ADS1605
ADS1606
PAP
PAP
−40°C to +85°C
−40°C to +85°C
ADS1605I
ADS1606I
TQFP−64
PowerPAD
(1)
For the most current specification and package information, refer to our web site at www.ti.com.
PRODUCT FAMILY
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range unless otherwise noted
PRODUCT
ADS1605
ADS1606
ADS1625
ADS1626
RESOLUTION
16 Bits
DATA RATE
FIFO?
No
ADS1605, ADS1606
−0.3 to +6
UNIT
5.0MSPS
5.0MSPS
1.25MSPS
1.25MSPS
AVDD to AGND
V
V
V
V
16 Bits
18 Bits
18 Bits
Yes
No
DVDD to DGND
−0.3 to +3.6
IOVDD to DGND
−0.3 to +6
Yes
AGND to DGND
−0.3 to +0.3
Input Current
100mA, Momentary
10mA, Continuous
−0.3 to AVDD + 0.3
−0.3 to IOVDD + 0.3
+150
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handledwith appropriate precautions. Failure to observe
Input Current
Analog I/O to AGND
Digital I/O to DGND
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
Lead Temperature (soldering, 10s)
V
V
proper handling and installation procedures can cause damage.
°C
°C
°C
°C
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
−40 to +105
−60 to +150
+260
(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
2
BB [ BURR-BROWN CORPORATION ]
