ADS1208
www.ti.com
SBAS348A–MARCH 2005–REVISED MARCH 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
Package/Ordering Information
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or see the TI web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
ADS1208I
–0.3 to +6
UNIT
V
Supply voltage, AGND to AVDD
Supply voltage, BGND to BVDD
–0.3 to +6
V
Analog input voltage with respect to AGND
Reference input voltage with respect to AGND
Digital input voltage with respect to BGND
Ground voltage difference AGND to BGND
Input current to any pin except supply
Power dissipation
AGND – 0.3 to AVDD + 0.3
AGND – 0.3 to AVDD + 0.3
BGND – 0.3 to BVDD + 0.3
±0.3
V
V
V
V
±10
mA
See Dissipation Ratings Table
Operating virtual junction temperature range, TJ
Operating free-air temperature range, TA
Storage temperature range, TSTG
–40 to +150
–40 to +85
–65 to +150
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
MIN
NOM
MAX
UNIT
Supply voltage, AGND to AVDD
4.5
2.7
5.0
5.5
3.6
V
V
V
V
V
Low-voltage levels
5V logic levels
Supply voltage, BGND to BVDD
4.5
5.0
2.5
5.5
Reference input voltage
Analog inputs
0.5
3.0
VIN+– VIN-
–VREFIN /20
+VREFIN /20
DISSIPATION RATINGS TABLE
DERATING FACTOR
ABOVE TA = 25°C
TA≤ 25°C
POWER RATING
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
BOARD
PACKAGE
RθJC
RθJA
Low-K(1)
High-K(2)
PW
PW
35°C/W
147°C/W
108.4°C
6.8mW/°C
850mW
544mW
738mW
442mW
600mW
33.6°C/W
9.225W/°C
1150mW
(1) The JEDEC low-K (1s) board used to derive this data was a 3in x 3in, two-layer board with 2-ounce copper traces on top of the board.
(2) The JEDEC high-K (2s2p) board used to derive this data was a 3in x 3in, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
2
BB [ BURR-BROWN CORPORATION ]
