ꢙꢚ ꢉꢛ ꢜ ꢝ ꢞ
ꢙꢚ ꢉꢛ ꢜ ꢝ ꢟ
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SBAS311 − MARCH 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
(1)
ORDERING INFORMATION
MAXIMUM
INTEGRAL
LINEARITY
ERROR
MAXIMUM
GAIN
ERROR
(%)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE-
LEAD
PACKAGE
DESIGNATOR
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT MEDIA,
QUANTITY
(%FS)
PRODUCT
TBD
TBD
TBD
TBD
ADS1206IDGKT
ADS1206IDGKR
ADS1207IDGKT
ADS1207IDGKR
Tape and Reel, 250
Tape and Reel, 2000
Tape and Reel, 250
Tape and Reel, 2000
ADS1206
0.012
0.012
0.7
0.7
VSSOP-8
VSSOP-8
DGK
DGK
−40°C to +85°C
−40°C to +85°C
ADS1207
(1)
For the most current package and ordering information, refer to our web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
ADS1204
UNIT
Supply Voltage, GND to V
DD
−0.3 to 7
V
Analog Input Voltage with Respect to GND
Reference Input Voltage with Respect to GND
Digital Input Voltage with Respect to GND
Input Current to Any Pin Except Supply
Power Dissipation
GND − 0.3 to V
+ 0.3
V
V
DD
DD
DD
GND − 0.3 to V
GND − 0.3 to V
+ 0.3
+ 0.3
V
−20 to 20
mA
See Dissipation Rating Table
−40 to +150
Operating Virtual Junction Temperature Range, T
°C
°C
°C
°C
J
Operating Free-Air Temperature Range, T
−40 to +85
A
Storage Temperature Range, T
STG
Lead Temperature (1.6mm or 1/16-inch from case for 10s)
−65 to +150
+260
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
MIN
3.0
NOM
MAX
3.6
UNIT
V
Low-Voltage Levels
Supply Voltage, GND to V
Reference Input Voltage
DD
5V Logic Levels
4.5
5
5.5
V
TBD
0
2.5
V
DD
V
BUF = 0
BUF = 1
ADS1206
ADS1207
V
V
REF
− 0.2
Analog Inputs
External Clock
0.1
V
V
DD
TBD
TBD
−40
1
MHz
MHz
°C
4
Operating Junction Temperature Range, T
105
J
(1)
with reduced accuracy, minimum clock can go up to 500kHz.
DISSIPATION RATING TABLE
T
≤ 25°C
DERATING FACTOR
(1)
ABOVE T = 25°C
A
T
= 70°C
T = 85°C
A
POWER RATING
A
A
POWER RATING
POWER RATING
BOARD
PACKAGE
DGK
(2)
Low-K
469.6mW
3.756mW/°C
5.531mW/°C
300.5mW
244.2mW
(3)
High-K
DGK
691.4mW
442.5mW
359.5mW
(1)
This is the inverse of the traditional junction-to-ambient thermal resistance (R
informational purposes only.
The JEDEC Low-K (1s) board design used to derive this data was a 3-inch x 3-inch, two-layer board with 2-ounce copper traces on top of the board.
The JEDEC High-K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on the top and bottom of the board.
). Thermal resistances are not production tested and are for
qJA
(2)
(3)
2
BB [ BURR-BROWN CORPORATION ]
