PACKAGE OPTION ADDENDUM
www.ti.com
18-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
ADS1100A0IDBVR
ADS1100A0IDBVT
ADS1100A1IDBVR
ADS1100A1IDBVT
ADS1100A1IDBVTG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
6
6
6
6
6
3000
250
None
None
None
None
CU NIPDAU Level-1-240C-UNLIM
CU NIPDAU Level-1-240C-UNLIM
CU NIPDAU Level-1-240C-UNLIM
CU NIPDAU Level-1-240C-UNLIM
DBV
DBV
3000
250
DBV
DBV
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
ADS1100A2IDBVR
ADS1100A2IDBVT
ADS1100A3IDBVR
ADS1100A3IDBVT
ADS1100A4IDBVR
ADS1100A4IDBVT
ADS1100A5IDBVR
ADS1100A5IDBVT
ADS1100A6IDBVR
ADS1100A6IDBVT
ADS1100A7IDBVR
ADS1100A7IDBVT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
6
6
6
3000
250
None
None
None
None
None
None
None
None
None
None
None
None
CU NIPDAU Level-1-240C-UNLIM
CU NIPDAU Level-1-240C-UNLIM
CU NIPDAU Level-1-240C-UNLIM
CU NIPDAU Level-1-240C-UNLIM
CU NIPDAU Level-1-240C-UNLIM
CU NIPDAU Level-1-240C-UNLIM
CU NIPDAU Level-1-240C-UNLIM
CU NIPDAU Level-1-240C-UNLIM
CU NIPDAU Level-1-240C-UNLIM
CU NIPDAU Level-1-240C-UNLIM
CU NIPDAU Level-1-240C-UNLIM
CU NIPDAU Level-1-240C-UNLIM
3000
250
3000
250
3000
250
3000
250
3000
250
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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