UltraThin Ceramic Capacitors
UT Series Specifications and Test Methods – Sn Termination
Parameter/Test
Operating Temperature Range
Capacitance
Dissipation Factor
Insulation Resistance
Dielectric Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Specification Limits
-55ºC to +85ºC
Within specified tolerance
≤ 3.0% for ≥ 25V DC rating
≤ 12.5% for ≤ 16V DC rating
100 MΩ - μF
No breakdown or visual defects
No defects
≤ ±12%
Meets Initial Values (As Above)
≥ Initial Value x 0.3
≥ 95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
≤ ±7.5%
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
≤ ±12%
≤ Initial Value x 2.0 (As Above)
≥ Initial Value x 0.3 (As Above)
Meets Initial Values (As Above)
No visual defects
≤ ±12%
≤ Initial Value x 2.0 (As Above)
≥ Initial Value x 0.3 (As Above)
Meets Initial Values (As Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
Charge device with 1.5X rated voltage
in test chamber set at
85ºC ± 2ºC for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
90 mm
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± 0.2V
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, with charge and discharge
current limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Resistance to
Flexure
Stresses
Solderability
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Dip device in eutectic solder at 245 ± 5ºC
for 5.0 ± 0.5 seconds
Resistance to
Solder Heat
Load Life
Load
Humidity
3
AVX [ AVX CORPORATION ]
