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SM045C156KHN650 参数 Datasheet PDF下载

SM045C156KHN650图片预览
型号: SM045C156KHN650
PDF下载: 下载PDF文件 查看货源
内容描述: AVX高级陶瓷电容器电源,高电压和Tip和Ring应用 [AVX Advanced Ceramic Capacitors for Power Supply, High Voltage and Tip and Ring Applications]
分类和应用: 电容器陶瓷电容器
文件页数/大小: 112 页 / 2013 K
品牌: KYOCERA AVX [ KYOCERA AVX ]
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Surface Mounting Guide  
MLC Chip Capacitors  
COMMON CAUSES OF  
REWORKING OF MLCs  
MECHANICAL CRACKING  
Thermal shock is common in MLCs that are manually  
attached or reworked with a soldering iron. AVX strongly  
recommends that any reworking of MLCs be done with hot  
air reflow rather than soldering irons. It is practically impossi-  
ble to cause any thermal shock in ceramic capacitors when  
using hot air reflow.  
The most common source for mechanical stress is board  
depanelization equipment, such as manual breakapart, v-  
cutters and shear presses. Improperly aligned or dull cutters  
may cause torqueing of the PCB resulting in flex stresses  
being transmitted to components near the board edge.  
Another common source of flexural stress is contact during  
parametric testing when test points are probed. If the PCB is  
allowed to flex during the test cycle, nearby ceramic capac-  
itors may be broken.  
However direct contact by the soldering iron tip often caus-  
es thermal cracks that may fail at a later date. If rework by  
soldering iron is absolutely necessary, it is recommended  
that the wattage of the iron be less than 30 watts and the  
tip temperature be <300ºC. Rework should be performed  
by applying the solder iron tip to the pad and not directly  
contacting any part of the ceramic capacitor.  
A third common source is board to board connections at  
vertical connectors where cables or other PCBs are con-  
nected to the PCB. If the board is not supported during the  
plug/unplug cycle, it may flex and cause damage to nearby  
components.  
Special care should also be taken when handling large (>6"  
on a side) PCBs since they more easily flex or warp than  
smaller boards.  
Solder Tip  
Solder Tip  
Preferred Method - No Direct Part Contact  
Poor Method - Direct Contact with Part  
PCB BOARD DESIGN  
To avoid many of the handling problems, AVX recommends that MLCs be located at least .2" away from nearest edge of  
board. However when this is not possible, AVX recommends that the panel be routed along the cut line, adjacent to where the  
MLC is located.  
No Stress Relief for MLCs  
Routed Cut Line Relieves Stress on MLC  
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