General Specifications
Mechanical
END TERMINATION ADHERENCE
BEND STRENGTH
Specification
Speed = 1mm/sec
No evidence of peeling of end terminal
2mm
Deflection
Measuring Conditions
R340mm
After soldering devices to circuit board apply 5N
(0.51kg f) for 10 1 seconds, please refer to Figure 1.
Supports
45mm
45mm
5N FORCE
Figure 2. Bend Strength
Specification
Appearance:
DEVICE UNDER TEST
Figure 1.
Terminal Adhesion
No visual defects
TEST BOARD
Capacitance Variation
C0G (NP0): 5% or .5pF, whichever is larger
X7R: ≤ 12%
RESISTANCE TO VIBRATION
Specification
Z5U: ≤ 30%
Y5V: ≤ 30%
Appearance:
No visual defects
Insulation Resistance
C0G (NP0): ≥ Initial Value x 0.3
X7R: ≥ Initial Value x 0.3
Z5U: ≥ Initial Value x 0.1
Y5V: ≥ Initial Value x 0.1
Capacitance
Within specified tolerance
Q, Tan Delta
To meet initial requirement
Measuring Conditions
Please refer to Figure 2
Insulation Resistance
C0G (NP0), X7R Ն Initial Value x 0.3
Z5U, Y5V Ն Initial Value x 0.1
Deflection:
2mm
Measuring Conditions
Test Time:
30 seconds
Vibration Frequency
10-2000 Hz
RESISTANCE TO SOLDER HEAT
Maximum Acceleration
20G
Specification
Swing Width
Appearance:
No serious defects, <25% leaching of either end
terminal
1.5mm
Test Time
X, Y, Z axis for 2 hours each, total 6 hours of test
Capacitance Variation
C0G (NP0): 2.5% or 2.5pF, whichever is greater
X7R: ≤ 7.5%
SOLDERABILITY
Specification
Z5U: ≤ 20%
Y5V: ≤ 20%
Ն 95% of each termination end should be covered with
fresh solder
Q, Tan Delta
To meet initial requirement
Measuring Conditions
Insulation Resistance
Dip device in eutectic solder at 230 5°C for
To meet initial requirement
2
.5 seconds
Dielectric Strength
No problem observed
Measuring Conditions
Dip device in eutectic solder at 260°C, for 1 minute.
Store at room temperature for 48 hours (24 hours for
C0G (NP0)) before measuring electrical parameters.
Part sizes larger than 3.20mm x 2.49mm are reheated
at 150°C for 30 5 seconds before performing test.
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KYOCERA AVX [ KYOCERA AVX ]
