Accu-F
®
/ Accu-P
®
Environmental / Mechanical Characteristics
ENVIRONMENTAL CHARACTERISTICS
TEST
Life (Endurance)
MIL-STD-202F Method 108A
Accelerated Damp
Heat Steady State
MIL-STD-202F Method 103B
Temperature Cycling
MIL-STD-202F Method 107E
MIL-STD-883D Method 1010.7
Resistance to Solder Heat
IEC-68-2-58
CONDITIONS
125°C, 2U
R
,1000 hours
REQUIREMENT
No visible damage
∅
C/C
≤
2% for C≥5pF
∅
C
≤
0.25pF for C<5pF
No visible damage
∅
C/C
≤
2% for C≥5pF
∅
C
≤
0.25pF for C<5pF
No visible damage
∅
C/C
≤
2% for C≥5pF
85°C, 85% RH, U
R
, 1000 hours
-55°C to +125°C, 15 cycles – Accu-P
®
-55°C to +125°C, 5 cycles – Accu-F
®
260°C ± 5°C for 10 secs
∅
C
≤
0.25pF for C<5pF
C remains within initial limits
MECHANICAL CHARACTERISTICS
TEST
Solderability
IEC-68-2-58
Leach Resistance
IEC-68-2-58
Adhesion
MIL-STD-202F Method 211A
Termination Bond Strength
IEC-68-2-21 Amend. 2
CONDITIONS
Components completely immersed in a
solder bath at 235°C for 2 secs.
Components completely immersed in a
solder bath at 260±5°C for 60 secs.
A force of 5N applied for 10 secs.
Tested as shown in diagram
D
REQUIREMENT
Terminations to be well tinned, minimum 95%
coverage
Dissolution of termination faces
≤15%
of area
Dissolution of termination edges
≤25%
of length
No visible damage
No visible damage
∅
C/C
≤
2% for C≥5pF
∅
C
≤
0.25pF for C<5pF
45mm
D = 3mm Accu-P
D = 1mm Accu-F
45mm
Robustness of Termination
IEC-68-2-21 Amend. 2
High Frequency Vibration
MIL-STD-202F Method 201A,
204D
(Accu-P
®
only)
Storage
A force of 5N applied for 10 secs.
55Hz to 2000Hz, 20G
12 months minimum with components
stored in “as received” packaging
No visible damage
No visible damage
Good solderability
QUALITY & RELIABILITY
Accu-P
®
is based on well established thin-film technology
and materials.
• ON-LINE PROCESS CONTROL
This program forms an integral part of the production cycle
and acts as a feedback system to regulate and control
production processes. The test procedures, which are
integrated into the production process, were developed
after long research work and are based on the highly
developed semiconductor industry test procedures and
equipment. These measures help AVX to produce a con-
sistent and high yield line of products.
Average capacitance with histogram printout for
capacitance distribution;
IR and Breakdown Voltage distribution;
Temperature Coefficient;
Solderability;
Dimensional, mechanical and temperature stability.
QUALITY ASSURANCE
The reliability of these thin-film chip capacitors has been
studied intensively for several years. Various measures
have been taken to obtain the high reliability required today
by the industry. Quality assurance policy is based on well
established international industry standards. The reliability
of the capacitors is determined by accelerated testing
under the following conditions:
Life (Endurance)
125°C, 2U
R
, 1000 hours
Accelerated Damp
Heat Steady State
85°C, 85% RH, U
R
,
1000 hours.
• FINAL QUALITY INSPECTION
Finished parts are tested for standard electrical parameters
and visual/mechanical characteristics. Each production lot
is 100% evaluated for: capacitance and proof voltage at
2.5 U
R
. In addition, production is periodically evaluated for:
20
AVX [ AVX CORPORATION ]
