®
®
Accu-F m Accu-P
Environꢀental m Mechanical Characteristics
ENVIRONMENTAL CHARACTERISTICS
TEST
CONDITIONS
REQUIREMENT
Life (Endurance)
MIL-STD-202F Method 108A
125°C, 2UR,1000 hours
No visible damage
∅C/C ≤ 2ꢀ for C≥5pF
∅C ≤ 0.25pF for C<5pF
Accelerated Daꢀp
85°C, 85ꢀ RH, UR, 1000 hours
No visible damage
Heat Steady State
MIL-STD-202F Method 103B
∅C/C ≤ 2ꢀ for C≥5pF
∅C ≤ 0.25pF for C<5pF
1
Teꢀperature Cycling
MIL-STD-202F Method 107E
MIL-STD-883D Method 1010.7
-55°C to +125°C, 15 cycles – Accu-P®
-55°C to +125°C, 5 cycles – Accu-F®
No visible damage
∅C/C ≤ 2ꢀ for C≥5pF
∅C ≤ 0.25pF for C<5pF
Resistance to Solder Heat
IEC-68-2-58
260°C 5°C for 10 secs
C remains within initial limits
MECHANICAL CHARACTERISTICS
TEST
CONDITIONS
REQUIREMENT
Solderability
IEC-68-2-58
Components completely immersed in a
solder bath at 235°C for 2 secs.
Terminations to be well tinned, minimum 95ꢀ
coverage
Leach Resistance
IEC-68-2-58
Components completely immersed in a
solder bath at 260 5°C for 60 secs.
Dissolution of termination faces ≤15ꢀ of area
Dissolution of termination edges ≤25ꢀ of length
Adhesion
A force of 5N applied for 10 secs.
No visible damage
MIL-STD-202F Method 211A
Terꢀination Bond Strength
IEC-68-2-21 Aꢀend. 2
Tested as shown in diagram
No visible damage
∅C/C ≤ 2ꢀ for C≥5pF
∅C ≤ 0.25pF for C<5pF
D
D = 3mm Accu-P
D = 1mm Accu-F
45mm
45mm
Robustness of Terꢀination
IEC-68-2-21 Aꢀend. 2
A force of 5N applied for 10 secs.
55Hz to 2000Hz, 20G
No visible damage
No visible damage
High Frequency Vibration
MIL-STD-202F Method 201A,
®
204D (Accu-P only)
Storage
12 months minimum with components
stored in “as received” packaging
Good solderability
Average capacitance with histogram printout for
capacitance distribution;
QUALITY & RELIABILITY
Accu-P is based on well established thin-film technology
and materials.
®
IR and Breakdown Voltage distribution;
Temperature Coefficient;
Solderability;
• ON-LINE PROCESS CONTROL
Dimensional, mechanical and temperature stability.
This program forms an integral part of the production cycle
and acts as a feedback system to regulate and control
production processes. The test procedures, which are
integrated into the production process, were developed
after long research work and are based on the highly
developed semiconductor industry test procedures and
equipment. These measures help AVX to produce a con-
sistent and high yield line of products.
QUALITY ASSURANCE
The reliability of these thin-film chip capacitors has been
studied intensively for several years. Various measures
have been taken to obtain the high reliability required today
by the industry. Quality assurance policy is based on well
established international industry standards. The reliability
of the capacitors is determined by accelerated testing
under the following conditions:
• FINAL QUALITY INSPECTION
Life (Endurance)
Accelerated Damp
Heat Steady State
125°C, 2UR, 1000 hours
Finished parts are tested for standard electrical parameters
and visual/mechanical characteristics. Each production lot
is 100ꢀ evaluated for: capacitance and proof voltage at
2.5 UR. In addition, production is periodically evaluated for:
85°C, 85ꢀ RH, UR,
1000 hours.
20
KYOCERA AVX [ KYOCERA AVX ]
