®
Accu-P
Application Notes
PREHEAT & SOLDERING
CLEANING RECOMMENDATIONS
The rate of preheat in production should not exceed 4ꢀC/
second and a recommended maximum is about 2ꢀC/second.
Temperature differential from preheat to soldering should not
exceed 100ꢀC.
For further specific application or process advice, please consult
AVX.
Care should be taken to ensure that the devices are
thoroughly cleaned of flux residues, especially the space
beneath the device. Such residues may otherwise become
conductive and effectively offer a lossy bypass to the device.
Various recommended cleaning conditions (which must be
optimized for the flux system being used) are as follows:
Cleaning liquids. . . . . . . i-propanol, ethanol, acetylacetone,
water and other standard PCB
COOLING
cleaning liquids.
After soldering, the assembly should preferably be allowed
to cool naturally. In the event of assisted cooling, similar
conditions to those recommended for preheating should be
used.
Ultrasonic conditions . . power-20w/liter max.
frequency-20kHz to 45kHz.
Temperature. . . . . . . . . 80ꢀC maximum (if not otherwise
limited by chosen solvent system).
Time . . . . . . . . . . . . . . . 5 minutes max.
HAND SOLDERING & REWORK
Hand soldering is permissible. Preheat of the PCB to 150ꢀC is
required. The most preferable technique is to use hot air sol-
dering tools. Where a soldering iron is used, a temperature
controlled model not exceeding 30 watts should be used and
set to not more than 260ꢀC.
STORAGE CONDITIONS
Recommended storage conditions for Accu-P® prior to use
are as follows:
Temperature . . . . . . . . . . 15ꢀC to 35ꢀC
Humidity . . . . . . . . . . . . . ≤65ꢁ
Air Pressure . . . . . . . . . . 860mbar to 1060mbar
RECOMMENDED REFLOW
SOLDERING PROFILE
COMPONENTS WITH
SnPb TERMINATIONS
RECOMMENDED REFLOW
SOLDERING PROFILE
LEAD FREE
COMPONENTS WITH
Sn100 TERMINATIONS
330
Peak Temperature = 260ºC
260
250
200
150
100
50
0
0:00
0:43
1:28
2:10
2:53
3:36
Time
4:19
5:02
5:48
6:29
050118
29
KYOCERA AVX [ KYOCERA AVX ]
