Absolute Maximum Ratings
HER
Yellow
Green
HLMP-2500/
2800/2965
Series
AlGaAs Red
HLCP-X100
Series
HLMP-2300/ HLMP-2400/
2600/29XX
Series
Parameter
2700/2950
Series
Average Power Dissipated per LED Chip
Peak Forward Current per LED Chip
Average Forward Current per LED Chip
DC Forward Current per LED Chip
Reverse Voltage per LED Chip
37 mW[1]
135 mW[2]
85 mW[3]
135 mW[2]
[4]
[5]
[5]
[5]
45 mA
90 mA
60 mA
90 mA
15 mA
25 mA
20 mA
25 mA
[1]
[2]
[3]
[2]
15 mA
30 mA
25 mA
30 mA
[6]
5 V
6 V
Operating Temperature Range
–20°C to + 100°C[7]
–40°C to + 85°C
–20°C to + 85°C
Storage Temperature Range
–40°C to + 85°C
Wave Soldering Temperature
1.6 mm (1/16 inch) below Body
250°C for 3 seconds
Notes:
1. Derate above 87°C at 1.7 mW/°C per LED chip. For DC operation, derate above 91°C at 0.8 mA/°C.
2. Derate above 25°C at 1.8 mW/°C per LED chip. For DC operation, derate above 50°C at 0.5 mA/°C.
3. Derate above 50°C at 1.8 mW/°C per LED chip. For DC operation, derate above 60°C at 0.5 mA/°C.
4. See Figure 1 to establish pulsed operation. Maximum pulse width is 1.5 mS.
5. See Figure 6 to establish pulsed operation. Maximum pulse width is 2 mS.
6. Does not apply to bicolor parts.
7. For operation below –20°C, contact your local Avago sales representative.
Electrical/ Optical Characteristics at T = 25°C
A
AlGaAs Red HLCP-X100 Series
Parameter
HLCP-
Symbol
Min. Typ. Max. Units Test Conditions
A100/D100/E100
B100/C100/F100/G100
H100
IV
3
6
7.5
15
mcd
mcd
mcd
nm
nm
V
IF = 3 mA
Luminous Intensity
per Lighting Emitting
Area[1]
12
30
Peak Wavelength
λPEAK
λd
645
637
1.8
15
Dominant Wavelength[2]
Forward Voltage per LED
V
2.2
IF = 20 mA
F
Reverse Breakdown Voltage per LED
Thermal Resistance LED Junction-to-Pin
V
5
V
IR = 100 µA
R
RθJ-PIN
250
°C/W/
LED
6
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
