Package Outline Drawing
HCPL-354-000E
2.54
± 0.25
3.60 ± 0.3
5.30 ± 0.3
354
DATE CODE
4.40 ± 0.2
2.00 ± 0.2
Y W W
EAD
FREE
+ 0.2
– 0.7
0.10 ± 0.1
0.40 ± 0.1
7.00
RANK
DIMENSIONS IN MILLIMETERS.
HCPL-354-060E
2.54
± 0.25
3.60 ± 0.3
5.30 ± 0.3
354 V
DATE CODE
2.00 ± 0.2
Y W W
4.40 ± 0.2
EAD
FREE
+ 0.2
– 0.7
0.10 ± 0.1
0.40 ± 0.1
7.00
RANK
DIMENSIONS IN MILLIMETERS.
30 seconds
260 C (Peak Temperature)
Solder Reflow Temperature Profile
°
±) One-time soldering reflow is rec-
ommended within the condition
of temperature and time profile
shown at right.
250°C
217°C
200°C
150°C
2) When using another soldering
method such as infrared ray lamp,
the temperature may rise partially
in the mold of the device. Keep the
temperature on the package of the
device within the condition of (±)
above.
60 sec
25°C
60 ~ 150 sec
90 sec
Time (sec)
60 sec
Note: Non-halide flux should be used.
3
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
