Regulatory Information
The devices contained in this data sheet have been approved by the following agencies:
Agency/Standard
HCPL-4504
HCPL-J454
HCPL-0454
HCNW4504
UL1577
3750 Vrms /
1 minute,
3750 Vrms /
1 minute
3750 Vrms /
1 minute
5000 Vrms /
1 minute
Underwriters Laboratories (UL)
Recognized under UL1577,
Option 020 5000
Vrms / 1 minute
Component Recognition Program,
Category FPQU2, File E55361
Component 3750 Vrms /
3750 Vrms /
1 minute
3750 Vrms /
1 minute
5000 Vrms /
1 minute
Canadian Standards Association (CSA)
File CA88324
Acceptance
Notice #5
1 minute,
Option 020 5000
Vrms / 1 minute
Option 060
VIORM = 630 Vpeak
VIORM = 891
Vpeak
Option 060
VIORM = 560
Vpeak
VIORM = 1414
Vpeak
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
Insulation and Safety Related Specifications
Value
HCPL-
J454
HCPL-J454
All other
HCPL-
HCPL-
HCNW
Parameter
Symbol
4504 -400E/-600E options
0454
4504 Units Conditions
Minimum External
Air Gap
(External Clearance)
L(101)
7.1
8.0
7.4
8.0
4.9
9.6
mm Measured from input ter-
minals to output terminals,
shortest distance through air.
Minimum External
Tracking
(External Creepage)
L(102)
7.4
8.0
4.8
10.0
mm Measured from input ter-
minals to output terminals,
shortest distance path along
body.
Minimum Internal
Plastic Gap
0.08
0.5
0.5
0.08
1.0
mm Through insulation distance,
conductor to conductor,
(Internal Clearance)
usually the direct distance
between the photoemitter
and photodetector inside the
optocoupler cavity.
Minimum Internal
Tracking (Internal
Creepage)
NA
≥175
IIIa
NA
≥175
IIIa
NA
≥175
IIIa
NA
≥175
IIIa
4.0
mm Measured from input ter-
minals to output terminals,
along internal cavity.
Tracking Resistance
(Comparative
Tracking Index)
CTI
≥200 Volts DIN IEC 112/VDE 0303 Part 1
Isolation Group
IIIa
Material Group (DIN VDE
0110, 1/89, Table 1)
All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These di-
mensions are needed as a starting point for the equip-
ment designer when determining the circuit insulation
requirements.
creepage, the shortest distance path along the surface
of a printed circuit board between the solder fillets of
the input and output leads must be considered. There
are recommended techniques such as grooves and ribs
which may be used on a printed circuit board to achieve
desired creepage and clearances. Creepage and clear-
ance distances will also change depending on factors
such as pollution degree and insulation level.
However, once mounted on a printed circuit board, mini-
mum creepage and clearance requirements must be
met as specified for individual equipment standards. For
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