CNY17-X-300E
MODEL
NO.
7.3 ± 0.5
(0.287)
7.62 ± 0.3
(0.3)
0.35 +0.15/-0.10
(0.014)
LEAD FREE
A CNY17 -
Y Y WW
3.5 ± 0.5
(0.138)
6.5 ± 0.5
(0.256)
1.2 ± 0.1
(0.047)
2.54 ± 0.25
(0.1)
0.35 ± 0.25
(0.014)
1.0 ± 0.25
(0.039)
10.16 ± 0.3
(0.4)
ANODE
DATE
CODE
DIMENSIONS IN MILLIMETERS AND (INCHES)
2) When using another soldering method such as in-
frared ray lamp, the temperature may rise partially
in the mold of the device. Keep the temperature on
the package of the device within the condition of (1)
above.
Temperature (°C)
Solder Reflow Temperature Profile
1) One-time soldering reflow is recommended within
the condition of temperature and time profile shown
at right.
30 seconds
250°C
217°C
200°C
260°C (Peak Temperature)
150°C
60 sec
25°C
60 ~ 150 sec
90 sec
Time (sec)
60 sec
Note: Non-halide flux should be used.
Absolute Maximum Ratings
Storage Temperature, T
S
Operating Temperature, T
A
Lead Solder Temperature, max.
(1.6 mm below seating plane)
Average Forward Current, I
F
Reverse Input Voltage, V
R
Input Power Dissipation, P
I
Collector Current, I
C
Collector-Emitter Voltage, V
CEO
Emitter-Collector Voltage, V
ECO
Collector-Base Voltage, V
CBO
Collector Power Dissipation
Total Power Dissipation
Isolation Voltage, V
iso
(AC for 1 minute, R.H. = 40 ~ 60%)
–55˚C to +150˚C
–55˚C to +100˚C
260˚C for 10 s
60 mA
6V
100 mW
150 mA
70 V
6V
70 V
150 mW
250 mW
5000 Vrms
4
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
