8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)
11.3ꢀ 0.15
(0.443 0.006ꢁ
LAND PATTERN RECOMMENDATION
6
7
5
8
9.00 0.15
(0.ꢀ54 0.006ꢁ
1ꢀ.56
(0.5ꢀ4ꢁ
1
ꢀ
3
4
3.39
(0.09ꢁ
1.ꢀ
(0.051ꢁ
13.ꢀ0 0.ꢀ0
1.55
(0.061ꢁ
MAX.
(0.484 0.013ꢁ
11.00
MAX.
(0.4ꢀꢀꢁ
4.00
(0.158ꢁ
MAX.
1.80 0.15
(0.071 0.006ꢁ
1.00 0.15
(0.0ꢀ9 0.006ꢁ
0.75 0.35
(0.0ꢀ0 0.010ꢁ
+ 0.076
- 0.0051
3.54
(0.100ꢁ
BSC
0.354
+ 0.00ꢀꢁ
- 0.003ꢁ
(0.010
DIMENSIONS IN MILLIMETERS (INCHESꢁ.
7° NOM.
LEAD COPLANARITY = 0.10 mm (0.004 INCHESꢁ.
NOTE: FLOATING LEAD PROTRUSION IS 0.35 mm (10 milsꢁ MAX.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C 0.5 °C/SEC.
PEAK
TEMP.
245 °C
PEAK
TEMP.
240 °C
PEAK
TEMP.
230 °C
200
100
0
2.5 C 0.5 °C/SEC.
SOLDERING
30
TIME
160 °C
150 °C
140 °C
SEC.
200 °C
30
SEC.
3 °C + 1 °C/–0.5 °C
PREHEATING TIME
150 °C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
50
100
150
200
250
TIME (SECONDS)
NOTE: NON-HALIDE FLUX SHOULD BE USED.
6
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
