Selection for lower input current down to 250 μA is
available upon request.
The HCPL-0701 and HCPL-0700 are surface mount devices
packaged in an industry standard SOIC-8 footprint.
The SOIC-8 does not require “through holes” in a PCB.
This package occupies approximately one-third the
footprint area of the standard dual-in-line package. The
lead profile is designed to be compatible with standard
surface mount processes.
The HCNW139 and HCNW138 are packaged in a
widebody encapsulation that provides creepage and
clearance dimensions suitable for safety approval by
regulatory agencies worldwide.
Selection Guide
8-Pin DIP
(300 Mil)
Single
Channel
Package
6N139
6N138
HCPL-4701
[1]
Dual
Channel
Package
HCPL-
2731
[1]
2730
[1]
4731
[1]
Small Outline SO-8
Single
Dual
Channel
Channel
Package
Package
HCPL-
HCPL-
0701
0700
070A
[1]
0731
0730
073A
[1]
Widebody
Package
(400 mil)
Single
Channel
Package
HCNW139
HCNW138
Minimum
Input ON
Current
(I
F
)
0.5 mA
1.6 mA
40 μA
0.5 mA
Minimum
CTR
400%
300%
800%
300%
Absolute
Maxi-
mum
V
CC
18 V
7V
18 V
20 V
Hermetic
Single and
Dual
Channel
Packages
HCPL-
5701
[1]
5700
[1]
5731
[1]
5730
[1]
Note:
1. Technical data are on separate Avago publications.
2
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
