SDRAM
AS4SD2M32
Austin Semiconductor, Inc.
MECHANICAL DEFINITIONS
(Package Designator DGX)
N
N/2+1
Notes:
1. Controlling dimension: millimieters,
unless otherwise specified.
2. BSC = Basic lead spacing between
centers.
3. Dimensions D and E1 do not include
mold flash protrusions and should be
measured from the bottom of the
E
E1
package
.
4. Formed leads shall be planar with
respect to one another within 0.004
inches at the seating plane.
1
N/2
D
SEATING PLANE
A
ZD
L
α
e
b
C
A1
Plastic TSOP (T - Type II)
Plastic TSOP (T - Type II)
Millimeters
Inches
Millimeters
Inches
Symbol
Ref. Std.
No. Leads (N)
Min
Max
Min
Max
Symbol Min
Max
Min
Max
Ref. Std.
No. Leads (N)
54
86
A
A1
A2
b
C
D
E1
E
e
—
1.20
—
0.047
A
A1
A2
b
C
D
E1
E
e
—
1.20
0.05 0.15
0.95 1.05
0.17 0.27
0.12 0.21
22.02 22.42
10.16 BSC
11.56 11.96
0.50 BSC
—
0.047
0.05 0.15
—
0.002 0.006
—
0.002 0.006
0.037 0.041
0.007 0.011
0.005 0.008
0.867 0.8827
0.400 BSC
—
—
0.30 0.45
0.12 0.21
22.02 22.42
10.03 10.29
11.56 11.96
0.80 BSC
0.012 0.018
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.031 BSC
0.455 0.471
0.020 BSC
L
0.40 0.60
0.016 0.024
L
0.40 0.60
0.80 REF
0.61 REF
0.016 0.024
0.031 REF
0.024 BSC
L1
ZD
α
—
—
—
—
L1
ZD
α
0.71 REF
0° 8°
0°
8°
0°
8°
0°
8°
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
AS4SD2M32
Rev. 1.0 1/08
50
AUSTIN [ AUSTIN SEMICONDUCTOR ]
