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AS4DDR232M64PBG-38/ET 参数 Datasheet PDF下载

AS4DDR232M64PBG-38/ET图片预览
型号: AS4DDR232M64PBG-38/ET
PDF下载: 下载PDF文件 查看货源
内容描述: 32Mx64 DDR2 SDRAM集成塑封微电路 [32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit]
分类和应用: 内存集成电路动态存储器双倍数据速率
文件页数/大小: 28 页 / 363 K
品牌: AUSTIN [ AUSTIN SEMICONDUCTOR ]
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iPEM  
2.1 Gb SDRAM-DDR2  
Austin Semiconductor, Inc.  
AS4DDR232M64PBG  
WRITE COMMAND  
The WRITE command is used to initiate a burst write access  
to an active row. The value on the BA1–BA0 inputs selects  
the bank, and the address provided on inputs A0–9 selects  
the starting column location. The value on input A10  
determines whether or not auto precharge is used. If auto  
precharge is selected, the row being accessed will be  
precharged at the end of the WRITE burst; if auto precharge  
is not selected, the row will remain open for subsequent  
accesses.  
The time between the WRITE command and the fi rst rising  
DQS edge is WL ± tDQSS. Subsequent DQS positive rising  
edges are timed, relative to the associated clock edge, as ±  
tDQSS. tDQSS is specified with a relatively wide range (25  
percent of one clock cycle). All of the WRITE diagrams show  
the nominal case, and where the two extreme cases (tDQSS  
[MIN] and tDQSS [MAX]) might not be intuitive, they have also  
been included. Upon completion of a burst, assuming no  
other commands have been initiated, the DQ will remain  
High-Z and any additional input data will be ignored.  
Input data appearing on the DQ is written to the memory  
array subject to the DM input logic level appearing coincident  
with the data. If a given DM signal is registered LOW, the  
corresponding data will be written to memory; if the DM signal  
is registered HIGH, the corresponding data inputs will be  
ignored, and a WRITE will not be executed to that byteꢀcolumn  
location.  
Data for any WRITE burst may be concatenated with a  
subsequent WRITE command to provide continuous flow of  
input data. The fi rst data element from the new burst is  
applied after the last element of a completed burst. The new  
WRITE command should be issued x cycles after the first  
WRITE command, where x equals BLꢀ2.  
DDR2 SDRAM supports concurrent auto precharge options,  
as shown in Table 4.  
WRITE OPERATION  
WRITE bursts are initiated with a WRITE command, as  
shown in Figure 12. DDR2 SDRAM uses WL equal to RL  
minus one clock cycle [WL = RL - 1ꢁK = AL + (ꢁL - 1ꢁK)].  
The starting column and bank addresses are provided with  
the WRITE command, and auto precharge is either enabled  
or disabled for that access. If auto precharge is enabled, the  
row being accessed is precharged at the completion of the  
burst. For the generic WRITE commands used in the  
following illustrations, auto precharge is disabled.  
DDR2 SDRAM does not allow interrupting or truncating any  
WRITE burst using BL = 4 operation. Once the BL = 4 WRITE  
command is registered, it must be allowed to complete the  
entire WRITE burst cycle. However, a WRITE (with auto  
precharge disabled) using BL = 8 operation might be  
interrupted and truncated ONLY by another WRITE burst as  
long as the interruption occurs on a 4-bit boundary, due to  
the 4n prefetch architecture of DDR2 SDRAM. WRITE burst  
BL = 8 operations may not to be interrupted or truncated with  
any command except another WRITE command.  
During WRITE bursts, the first valid data-in element will be  
registered on the first rising edge of DQS following the WRITE  
command, and subsequent data elements will be registered  
on successive edges of DQS. The LOW state on DQS  
between the WRITE command and the first rising edge is  
known as the write preamble; the LOW state on DQS  
following the last data-in element is known as the write  
postamble.  
Data for any WRITE burst may be followed by a subsequent  
READ command. The number of clock cycles required to  
meet tWTR is either 2 or tWTRꢀtꢁK, whichever is greater.  
Data for any WRITE burst may be followed by a subsequent  
PREꢁHARGE command. tWT starts at the end of the data  
burst, regardless of the data mask condition.  
Austin Semiconductor, Inc.  
Austin, Texas 512.339.1188 www.austinsemiconductor.com  
AS4DDR232M64PBG  
Rev. 1.3 6/09  
18  
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