目录
1
2
芯片概述............................................................................................................................ 1
功能描述................................................................................................................ 2
2.1
2.2
2.3
2.5
2.6
2.7
摘要.......................................................................................................................... 2
报警功能模式...................................................................................................... 4
定时器................................................................................................................................ 4
重置................................................................................................................................. 4
电压低探测器........................................................................................................ 4
注册机构.......................................................................................................五
2.7.1
2.7.2
2.7.3
2.7.4
2.7.5
2.7.6
2.7.7
2.8
2.9
3
3.1
3.2
4
5
6
控制/状态寄存器1 ............................................. ........................................... 6
控制/状态寄存器2 ............................................. ........................................... 6
秒,分钟和小时寄存器............................................ ...................... 7
天,平日里,月/世纪和年注册........................................ 7
报警寄存器...................................................................................................... 9
CLKOUT频率寄存器............................................... ................................ 10
倒数计时器寄存器............................................... ................................... 10
2.4 CLKOUT输出.............................................................................................................. 4
EXT_CLK测试mode...................................................................................................... 11
上电复位覆盖模式............................................ ......................................... 12
I
2
C规范............................................................................................................ 12
I
2
AT8563了C ................................................................................................................ 14
串行接口.......................................................................................................................... 12
参数................................................................................................................................. 15
应用Reference............................................................................................................... 19
5.1
6.1
6.2
6.3
6.4
晶振频率调整............................................... .......................................... 19
DIP - 8 .............................................................................................................................. 20
SO8 ................................................................................................................................ 21
TSSOP8 .......................................................................................................................... 21
MSOP8 ........................................................................................................................... 22
封装外形......................................................................................................................... 20