ATmega640/1280/1281/2560/2561
Figure 1-3.
Pinout ATmega1281/2561
PF5 (ADC5/TMS)
PF6 (ADC6/TDO)
PF4 (ADC4/TCK)
PF7 (ADC7/TDI)
PF0 (ADC0)
PF1 (ADC1)
PF2 (ADC2)
PF3 (ADC3)
PA0 (AD0)
PA1 (AD1)
50
64
63
62
61
60
59
58
57
56
55
54
53
52
51
(OC0B) PG5
(RXD0/PCINT8/PDI) PE0
(TXD0/PDO) PE1
(XCK0/AIN0) PE2
(OC3A/AIN1) PE3
(OC3B/INT4) PE4
(OC3C/INT5) PE5
(T3/INT6) PE6
(ICP3/CLKO/INT7) PE7
(SS/PCINT0) PB0
(SCK/ PCINT1) PB1
(MOSI/ PCINT2) PB2
(MISO/ PCINT3) PB3
(OC2A/ PCINT4) PB4
(OC1A/PCINT5) PB5
(OC1B/PCINT6) PB6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
INDEX CORNER
49
PA2 (AD2)
AVCC
GND
AREF
GND
VCC
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PA3 (AD3)
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PG2 (ALE)
PC7 (A15)
PC6 (A14)
PC5 (A13)
PC4 (A12)
PC3 (A11)
PC2 (A10)
PC1 (A9)
PC0 (A8)
PG1 (RD)
PG0 (WR)
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
(T1) PD6
(RXD1/INT2) PD2
(SCL/INT0) PD0
(TXD1/INT3) PD3
(OC0A/OC1C/PCINT7) PB7
(XCK1) PD5
(ICP1) PD4
VCC
Note:
The large center pad underneath the QFN/MLF package is made of metal and internally con-
nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
(SDA/INT1) PD1
(TOSC2) PG3
(TOSC1) PG4
(T0) PD7
GND
XTAL2
RESET
XTAL1
32
4
2549NS–AVR–05/11
ATMEL [ ATMEL CORPORATION ]
