Package Information
Electrical Disturbances
Three areas of the FingerChip device must never be in contact with the casing, or any
other component, so as to avoid electrical disturbances. These areas are shown in Fig-
ure 21:
Figure 21. Sensitive Areas
6 mm
11.5 mm
Figure 22. Epoxy Overflow
Maximum epoxy overflow width: 0.35 mm on the die edge.
Maximum epoxy overflow thickness: 0.33 mm.
0.35
AA Section
Fingerchip
Epoxy Glue Overflow
Note:
Refer to Figure 19 on page 33.
Ordering Information
Package Device
_
105A
AT77C
CBXX
V
Atmel prefix
FingerChip family
Quality Level: Standard
Device type
Package
CB08: Chip On Board (COB)
Temperature range
V: -40˚ to +85˚C
34
AT77C105A [Preliminary]
5419A–BIOM–01/05