Packaging Information
32F, 32-Lead, Non-Windowed, Ceramic Bottom
32D6, 32-Lead, 0.600" Wide, Non-Windowed,
Brazed Flat Package (Flatpack)
Dimensions in Inches and (Millimeters)
MIL-STD-1835 F-18 CONFIG B
Ceramic Dual inline Package (Cerdip)
Dimensions in Inches and (Millimeters)
MIL-STD-1835 D-16 CONFIG A
42.70(1.68)
41.70(1.64)
PIN #1 ID
9.40(0.370)
6.86(0.270)
PIN
1
0.51(0.020)
0.38(0.015)
15.50(0.610)
21.08(0.830)
13.00(0.510)
20.60(0.811)
1.27(0.050) BSC
2.49(0.098)MAX
38.10(1.500) REF
5.72(0.225)
MAX
0.127(0.005)MIN
1.14(0.045) MAX
12.40(0.488)
11.99(0.472)
SEATING
PLANE
3.05(0.120)
2.49(0.098)
1.52(0.060)
0.38(0.015)
0.58(0.023)
0.36(0.014)
0.18(0.007)
0.10(0.004)
5.08(0.200)
3.18(0.125)
1.65(0.065)
1.14(0.045)
10.36(0.408)
9.02(0.355)
2.54(0.100)BSC
1.14(0.045)
0.66(0.026)
15.70(0.620)
15.00(0.590)
1.83(0.072)
0.76(0.030)
0º~ 15º REF
0.381(0.015)
0.203(0.008)
17.80(0.700) MAX
MIL-STD-1835 C-12
JEDEC OUTLINE MO-115
44L, 44-Pad, Non-Windowed, Ceramic Leadless
Chip Carrier (LCC)
32L, 32-Pad, Non-Windowed, Ceramic Leadless
Chip Carrier (LCC)
Dimensions in Inches and (Millimeters)*
Dimensions in Inches and (Millimeters)*
16.81(0.662)
16.26(0.640)
11.63(0.458)
11.23(0.442)
2.74(0.108)
2.16(0.085)
2.54(0.100)
2.16(0.085)
16.81(0.662)
16.26(0.640)
14.22(0.560)
13.72(0.540)
1.91(0.075)
2.03(0.080)
1.40(0.055)
1.40(0.055)
PIN 1
PIN 1
1.40(0.055)
1.14(0.045)
1.40(0.055)
1.14(0.045)
INDEX CORNER
INDEX CORNER
2.41(0.095)
1.91(0.075)
2.41(0.095)
1.91(0.075)
0.635(0.025)
X 45°
0.635(0.025)
X 45°
0.381(0.015)
0.381(0.015)
0.305(0.012)
0.178(0.007)
0.305(0.012)
0.178(0.007)
RADIUS
RADIUS
10.16(0.400) BSC
12.70(0.500) BSC
0.737(0.029)
0.533(0.021)
0.737(0.029)
0.533(0.021)
1.27(0.050) TYP
1.02(0.040) X 45°
1.27(0.050) TYP
1.02(0.040) X 45°
2.16(0.085)
1.65(0.065)
2.16(0.085)
1.65(0.065)
7.62(0.300) BSC
12.70(0.500) BSC
*Controlling dimension: millimeters
*Controlling dimension: millimeters
AT28C010 Mil
14
0010D–PEEPR–7/09
ATMEL [ ATMEL ]
