Technical Reference Note (APC08)
RECOMMENDED LOCATION FOR PICK AND PLACE
The flat top surface of the large inductor (topside of the board) provides a versatile and convenient way of picking up the
module (see Figure 46). A 6-7mm outside diameter nozzle from a conventional SMD machine is recommended to attain
maximum vacuum pick-up. Nozzle travel and rotation speed should be controlled to prevent this off-centered picked-up
module from falling off the nozzle. The use of vision recognition systems for placement accuracy will be very helpful.
RECOMMENDED REFLOW PROFILE
REFLOW NOTES / RECOMMENDATIONS
240
220
200
180
160
140
120
100
80
PEAK TEMPERATURE
200°C - 230°C
183°C
1. Refer to the recommended Reflow Profile per
Figure 47. Profile parameters exceeding the
recommended maximums may result to
permanent damage to the module.
REFLOW
ZONE
2. The module is recommended for topside
reflow process to the host card. For other
orientations, contact factory.
< 80 sec
110°C
PRE-HEAT ZONE
120 - 180 sec
3. In the event that the module needs to be
desoldered from the host card, some pins
may be detached from the module.
SLOPE
< 4°C /sec
60
40
20
0
0
30
60
90
120
150
180
210
240
270
300
TIME (seconds)
Figure 47. Recommended Reflow Profile.
Note 1
APC08MMMFFF
YYWWDPPLL
MODULE MARKINGS / LABELS
MMM
FFF
Note 2
YYWW
D
Model No
Option
Marking shall be permanent and legible.
Please refer to Figure 48 for the module
marking/ label detail.
Year / Work Week
Day of Week
nth Panel of the day
Location in the panel
PP
LL
Note 3: Barcode
6 & 7 characters / line
Code 128, 32CPI
0.070" Height
Figure 48. Module Label
MODEL: APC08 SERIES
SHEET 21 OF 23
OCTOBER 4, 2004 - REVISION 03
ASTEC [ Astec America, Inc ]
