GBU8005 thru GBU810
8.0 A Single-Phase Bridge Rectifier
GBU
3.85
+
0.25
2
21.9
+
0.5
4.4
+
0.2
1.95
+
0.25
4.2
+
0.2
Rectifier Reverse Voltage 50 to 1000V
Features
18.6
+
0.3
Ideal for P.C. Board mounting
High surge current capability
20.4
+
0.3
The plastic material used carries Underwriters
Laboratory flammability recognition 94V-0
High temperature soldering guaranteed 265 C /10
seconds at 5 lbs (2.3kg) tension
16.0
+
0.4
_
1.9 R. TYP.
(2PLACES)
~ ~
+
10.8
+
0.5
3.4
+
0.2
Mechanical Data
Case: Molded plastic body
Terminals: Plated leads solderable per MIL-STD-202,
Method 208
Polarity: Polarity symbols molded on body
Mounting Position:: Any
Mounting Torque: 5 in-lbs max.
Weight: 4.0 grams (approx)
1.3
+
0.2
5.1
+
0.5
Dimensions in millimeters(1mm =0.0394")
Maximum Ratings & Thermal Characteristics
Rating at 25 C ambient temperature unless otherwise specified, Resistive or Inductive load, 60 Hz.
For Capacitive load derate current by 20%.
GBU GBU GBU GBU GBU GBU
Parameter
Symbol
8005
801
802
804
806
808
Maximum repetitive peak reverse voltage
Maximum RMS bridge input voltage
Maximum DC blocking voltage
Maximum average forward
(with heatsink note1 )
rectified current at T
A
=100 C
(without heatsink)
Peak forward surge current single sine-wave
superimposed on rated load (JEDEC Method)
Rating for fusing ( t<8.3ms)
Typical thermal resistance per element
(note 1)
Operating junction and storage temperature
range
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
I t
R
thJC
T
J
,
T
STG
2
50
35
50
100
70
100
200
140
200
400
280
400
8.0
3.2
200
166
2.2
-55 to + 150
600
420
600
800
560
800
GBU
810
unit
1000 V
700
1000
V
V
A
A
A
sec
C/W
C
2
Electrical Characteristics
Rating at 25 C ambient temperature unless otherwise specified. Resistive or Inductive load, 60Hz.
For Capacitive load derate by 20 %.
GBU
Parameter
Symbol
8005 GBU GBU GBU GBU GBU
801
802
804
806
808
Maximum instantaneous forward voltage drop
1.1
V
F
per leg at 4.0A
Maximum DC reverse current at rated T
A
=25 C
DC blocking voltage per element
T
A
=125 C
I
R
5.0
500
GBU
Unit
810
V
A
Notes:
(1) Device mounted on 100mm x 100mm x 1.6mm Cu Plate Heatsink.
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ASEMI [ 台湾ASEMI ]
