AWG2023
6. Package Outline (SOT89, 4.5x4.0x1.5 mm)
Part No.
Lot No.
Dimensions (In mm)
Symbols
MIN
1.40
0.89
0.36
0.41
0.38
4.40
1.40
3.64
2.40
2.90
0.35
0.65
1.40
NOM
1.50
1.04
0.42
0.47
0.40
4.50
1.60
---
2.50
3.00
0.40
0.75
1.50
MAX
1.60
1.20
0.48
0.53
0.43
4.60
1.75
4.25
2.60
3.10
0.45
0.85
1.60
A
L
b
b1
C
D
D1
E
E1
e1
H
WG2023
Pxxxx
S
e
7. Surface Mount Recommendation (In mm)
NOTE
1. The number and size of ground via holes in a
circuit board are critical for thermal and RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of the lead pin 2 and
exposed pad of the device for better RF and
thermal performance, as shown in the drawing at
the left side.
12/13
ASB Inc.
sales@asb.co.kr
January 2017
ASB [ ADVANCED SEMICONDUCTOR BUSINESS INC. ]
