AWB31D9
10.
Package Outline (SOIC8)
Part No.
Dimensions (In mm)
Symbols
MIN
1.40
0.00
---
0.33
0.19
4.80
3.20
5.80
3.80
2.30
---
NOM
1.50
---
1.45
---
MAX
1.60
0.10
---
A
A1
A2
B
C
D
D2
E
E1
E2
e
0.51
0.25
5.00
3.40
6.20
4.00
2.50
---
\
---
---
3.30
6.00
3.90
2.40
1.27
---
L
y
0.40
---
1.27
0.10
8
---
---
0
---
---
0.12
L1-L1
L1
1.04REF
11.
Surface Mount Recommendation (In mm)
NOTE
1. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
2. To ensure reliable operation, device ground
paddle-to-ground pad soldering is critical.
3. Add mounting screws near the part to fasten the
board to a heat sinker. Ensure that the ground &
thermal via region contacts the heat sinker.
4. A proper heat dissipation path underneath the area
of the PCB for the mounted device is strictly
required for proper thermal operation. Damage to
the device can result from inappropriate heat
dissipation.
20/21
ASB Inc.
sales@asb.co.kr
June 2017
ASB [ ADVANCED SEMICONDUCTOR BUSINESS INC. ]
