ASX521
250-3000 MHz MMIC Amplifier
Outline Drawing
Part No.
Symbols
A
A1
A2
B
C
D
D2
E
E1
E2
e
L
y
q
|L1-L1’|
L1
Dimensions (In mm)
MIN
NOM
MAX
1.40
1.50
1.60
0.00
---
0.10
---
1.45
---
0.33
---
0.51
0.19
---
0.25
4.80
---
5.00
3.20
3.30
3.40
5.80
6.00
6.20
3.80
3.90
4.00
2.30
2.40
2.50
---
1.27
---
0.40
---
1.27
---
---
0.10
---
0°
8°
---
---
0.12
1.04REF
●
Mounting Recommendation (in mm)
ASX521
Pin No.
1
2
3
4
Function
2nd stage RF IN
1st stage RF OUT
GND
1st stage RF IN
Pin No.
5
6
7
8
Function.
GND
2nd stage RF OUT
2nd stage RF OUT
GND
Note: 1. Backside metal paddle is RF and DC ground.
Note:
1. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
2. To ensure reliable operation, device ground paddle-to-ground
pad soldering is critical.
3. Add mounting screws near the part to fasten the board to a heat
sinker. Ensure that the ground / thermal via region contacts the
heat sinker.
4. A proper heat dissipation path underneath the area of the PCB
for the mounted device is strictly required for proper thermal op-
eration. Damage to the device can result from inappropriate heat
dissipation.
ESD Classification
HBM
MM
Class 1B
Voltage Level: 500 V~1000 V
Class A
Voltage Level: <200 V
CAUTION: ESD-sensitive device!
Moisture Sensitivity Level (MSL)
Level 3 at 260°C reflow
2/12
ASB Inc.
·
sales@asb.co.kr
·
Tel: +82-42-528-7223
February 2010
ASB [ ADVANCED SEMICONDUCTOR BUSINESS INC. ]
