ASW234
5-8000 MHz MMIC Amplifier
Outline Drawing
Symbols
A
A1
A2
b
C
D
F
E1
e
e1
L
MIN
0.90
0.025
0.875
0.20
0.10
1.90
1.15
2.00
--
--
--
Dimensions (In mm)
NOM
1.00
0.062
0.937
0.30
0.125
2.00
1.25
2.10
0.65BSC
1.30BSC
0.425REF
MAX
1.10
0.10
1.00
0.40
0.15
2.10
1.35
2.20
--
--
--
Pin NO.
1
2
3
Function
RF OUT / Bias
GND
GND
Pin NO.
4
5
6
Function.
RF IN
GND
GND
Mounting Recommendation (in mm)
Note:
1. The number and size of ground via holes in a circuit
board is critical for thermal and RF grounding consid-
erations.
2. We recommend that the ground via holes be placed on
the bottom of lead pin 2 for better RF and thermal per-
formance, as shown in the drawing at the left side.
ESD Classification & Moisture Sensitivity Level
ESD Classification
HBM
MM
Class 1A
Voltage Level: 400 V
Class A
Voltage Level: 50 V
CAUTION: ESD-sensitive device!
Moisture Sensitivity Level (MSL)
Level 3 at 260°C reflow
2/8
ASB Inc.
·
sales@asb.co.kr
·
Tel: +82-42-528-7223
February 2010
ASB [ ADVANCED SEMICONDUCTOR BUSINESS INC. ]
