ASF130
5. Package Outline (SOT363, 2.1x2.0x1.0 mm)
Dimensions (In mm)
Symbols
MIN
0.900
0.025
0.875
0.200
0.100
1.900
1.150
NOM
1.000
0.062
0.937
0.300
0.125
2.000
1.250
2.100
MAX
1.10
0.10
1.00
0.40
0.15
2.10
1.35
2.20
A
A1
A2
b
C
D
F
E1
e
e1
L
2.000
0.65BSC
1.30BSC
0.425REF
6. Surface Mount Recommendation (In mm)
1.48
NOTE
0.30
0.30
1. The number and size of ground via holes in a
circuit board are critical for thermal and RF
grounding considerations.
1.23
0.42
2. Recommend is that the ground via holes be
placed on the bottom of the ground leads and
exposed pad of the device for better RF and
thermal performance, as shown in the drawing at
the left side.
0.50
10/11
ASB Inc.
sales@asb.co.kr
February 2017
ASB [ ADVANCED SEMICONDUCTOR BUSINESS INC. ]
