Technical Reference Note
Rev.02.06.15_#1.2
AVO75B-36S3V3
Page 16
Thermal Considerations –Baseplate module
The converter is designed to operate in different thermal environments and sufficient cooling must be provided. Proper
cooling can be verifiedby measuring the temperature at the test points as shown in Figure 16. The temperature at these
points should not exceed the maximum values in Table 7.
.
Figure 16 Temperature test point
Table 7. Temperature limit of the test point
Test Point
Temperature Limit
113 OC
P1
P2
P3
112 OC
110 OC
The converter can also operate with a smaller heatsink and sufficient airflow. Figure 18, 19 show the derating output
current vs. ambient air temperature at different air velocity with a specified heatsink. The typical test condition is shown in
Figure 17. For a typical application, forced airflow direction is from Vin- to Vin+. Figure 20 shows the thermal image taken
by a RF camera at a rated I/O condition.
Figure 17 Typical test condition, heatsink size (L*W*H): 57.9mm * 22.86mm * 6.3mm
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