Series 351000 SSOP-to-DIP
RoHS/WEEE-Compliant Adapter
FEATURES
• RoHS/WEEE-Compliant
• Allows the use of 0.65mm pitch surface mount ICs in thru-hole designs.
• Ideal for prototyping and testing/evaluating SSOP ICs.
• Adapter can be cut to smaller sizes by end user.
• Consult factory for Panelized Form or for mounting of consigned ICs.
GENERAL SPECIFICATIONS
• ADAPTER BODY: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101C/26 with 1-oz.
Cu traces, both sides
• PADS: finished with ENIG (Immersion Au over Electroless Ni)
• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
• PIN PLATING: 10µ [0.25µ] min. Au per MIL-G-45204 over 100µ [2.54µ] min. Ni
per SAE AMS-QQ-N-290
• CURRENT RATING: 1 amp
• OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
• SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
• Will plug into standard IC socket
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
CUSTOMIZATION:
In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE:
Aries reserves the
right to change product general specifications without notice.
ORDERING INFORMATION
16-351000-11RC
16-351000-11RC-P
for Panelized Version
“A” # OF PINS PER ROW x 0.100 [2.54]
“B” (# OF PINS PER ROW -1) x 0.100 [2.54]
“C” (# OF PADS PER ROW -1) x 0.0256 [0.65]
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18036RC
Rev. AA
ARIES [ ARIES ELECTRONICS, INC. ]
