RoHs/WEEE-Compliant
SOIC-to-JEDEC TO Adapter
FEATURES
• Pb-Free RoHs/WEEE-compliant
• 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin
footprint on the bottom. ICs now available only in 8-position SOIC packages can be
readily mounted on boards having JEDEC TO thru-hole footprints without having to
redesign the board.
• Consult factory for mounting of consigned chips.
GENERAL SPECIFICATIONS
• ADAPTER BOARD: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101A/26 with
1-oz. Cu traces, both sides
• MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
• MALE PIN PLATING: 10µ [0.254µ] min. Au per MIL-G-45204 over 100µ [2.54µ]
Ni per SAE AMS-QQ-N-290
• OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
CUSTOMIZATION:
In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE:
Aries reserves the
right to change product general specifications without notice.
• SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
ORDERING INFORMATION
P/N
1109814-RC
Dim “C”
0.200 [5.08]
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
DIP-to-TO ADAPTER ALSO AVAILABLE. CONSULT
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18013RC
Rev. AA
ARIES [ ARIES ELECTRONICS, INC. ]
