AVxx16K Series
11. BONDING DIAGRAM:
Y
1
9
2
8
3
7
5
6
4
( 0, 0 )
X
Chip size:
AVH316K : X=1074 um, Y=758 um
AV0716K : X=1074 um, Y=884 um
AV1416K : X=1080 um, Y=1180 um
AV2116K : X=1074 um, Y=1462 um
AV2816K : X=1080 um, Y=1760 um
AV4216K : X=1074 um, Y=2328 um
Pad size: 80 um x 80 um
※ The IC substrate must be connected to GND.
12. PAD LOCATION:
Pad No.
Pad Name
OKY
X
90
Y
1
2
3
4
5
6
7
8
9
294
184
74
IO1
90
IO2
90
GND1
PWM1
Vdd
231
396
623
849
940
906
52
52
52
PWM2
GND2
OSC
52
161
281
9
Rev 1.1
2003/9/18